One day Workshop on PCB Assembling & Soldering Techniques

Department: Electrical and Electronics Engineering

 B. Tech and Diploma II Sem

Date and Duration: 13/04/2024, duration:-1 Day

Title:  “PCB Assembling & Soldering Techniques”

Resource person/agency and affiliation:  Virendra Singh Solanki, AP, EEE department, Mandsaur University, Mandsaur (M.P.)

Department of Electrical and Electronics Engineering Mandsaur University Organized an ABL on “PCB Assembling & Soldering Techniques” on April 13, 2024 for B. Tech and Diploma Students. 

The resource person of the workshop was Virendra Singh Solanki, AP, EEE department. In his presentation, he explained the fundamentals of PCBs, their fabrication techniques including soldering and disordering along with practical aspects and their utilization in the various applications.

He gave an introduction to the Fabrication Environment and also explained the process of converting from File to Film, Printing the Inner layers, Removing the Unwanted Copper, and Layer Alignment.

Then in a hands-on workshop PCB soldering and disordering process with creating a working circuit. All the students responded that they had learned and had hands-on experience in designing a PCB. They were very excited about participating in this workshop and requested more workshops similarly so that they could simultaneously gain practical knowledge.

At the end of the workshop, HOD EEE Mr. Virendra Jain interacted with all the students and suggested they learn practical procedures along with the theoretical concepts through such types of workshops.

Outcome: The workshop presents the PCB fabrication method with its hands-on practice

• To make aware of do’s and don’ts of making PCB to students.
• To offer the practical guidelines of various approaches in PCB layout design.
• To make aware about various circuits, this can be used often by students.
• To motivate the students to keep designing such circuits.

No. of participants: 12

Prepared by :  Virendra Singh Solanki, AP, EEE department

Verified and Submitted by (HOD/HOI): Mr.Virendra Jain, HOD, EEE Department